Showing results: 4396 - 4410 of 4427 items found.
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GX3700 -
Marvin Test Solutions, Inc.
The GX3700 is a user configurable, FPGA-based, 3U PXI card which offers 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features 47,500 logic elements and 2.1 kb of memory. The GX3700 is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded into the FPGA directly or via an on-board EEPROM.
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AIM GmbH
AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.
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OET -
PSE Instruments GmbH
A comprehensive analysis of PV modules includes many different parameters. Determining the normal module operating temperature (NMOT), incidence angle effects and comparing soiling effects on different modules up to the initial degradation of PV modules are all parameters that can be analyzed with our outdoor exposure tester. The tester comes with up to twelve electronic loads installed in a 19" rack. The loads have two main functions: maximum power point tracking (MPPT) and IV curve tracing. For the advanced analysis, it is possible to change between these two modes within one test. In the normal operation mode, the electronic load keeps the module under MPP and each predefined interval an IV curve is traced. The entire tester comes with all necessary sensors such as temperature sensor, which can be attached to the module to determine the NMOT temperature like defined in IEC 61215 (MQT 05) and IEC 61853-2. The irradiation sensor is also included. In combination with our tracking system P2, it is also possible to determine incident angle effects of the PV module. It is also possible to connect other irradiation sensors for diffuse and direct irradiation, which helps to understand the behavior of the module in different irradiation conditions. An optional albedo meter is a powerful tool for the analysis of bifacial modules. The entire graphical user interface is web based and offers the possibility to access the system from the all computers in the network.
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FISCHERSCOPE MMS PC2 -
Helmut Fischer AG
Coating thickness measurement and material testing with just one instrument!Compact and extremely versatile desktop multi-function measuring system with data archiving and measurement data processing capabilities.User-friendly operation with large, high-resolution color LCD touch screen. Windows CE based.Many different plug-in testing modules allow numerous instrument configurations to meet the needs of the user. The modular design allows the upgrading of the instrument at any time. Similar or different modules can be installed depending on the applications.Different physical measurement principles are applied by the plug-in modules BETASCOPE, SIGMASCOPE, PHASCOPE, DUPLEX, NICKELSCOPE, SR-SCOPE and PERMASCOPE, Details see brochure.Multi-channel measurements at up to 8 measurement locationsA great variety of probes for different test piece geometries and measuring ranges are available.Delivery with PC software FISCHER DataCenter with the following functionality: Transferring and archiving measurement data, comprehensive statistical and graphical evaluations, easy creation and printing of inspection reports
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GX3700e -
Marvin Test Solutions, Inc.
The GX3700e is a user configurable, FPGA–based, 3U PXI Express card offering 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3700e is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded directly into the FPGA or via an on-board EEPROM.
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NSP Series 5KVA to 100KVA -
Aplab Limited
- Designed for powering critical Industrial and IT systems- DSP controlled IGBT based PWM technology- Design topology enables N+1 parallel redundancy- Industrial grade high speed CAN bus communication- User Friendly Matrix LCD and LED mimic front control and digital monitoring- Fully rated make before break maintenance bypass operation- Optional break-less load transfer via static switch- Low harmonic distortion- High crest factor tolerance and dynamic stability- Lower TCO- Continuous full rated power at ambient as high as 45°C- N+1 Parallel operation of UPS without any common hardware- Advanced Communication Capability (RS485/Modbus/SNMP)- High branch fuse clearing capacity- On-line battery bank test without load disconnection- Compact, elegant, and light weight enclosure- Easy installation with wheels for maneuverability and front bottom terminals
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NSP Series 20KVA to 200KVA -
Aplab Limited
- Designed for powering critical Industrial and IT systems- DSP controlled IGBT based PWM technology- Design topology enables N+1 parallel redundancy- Industrial grade high speed CAN bus communication- User Friendly Matrix LCD and LED mimic front control and digital monitoring- Fully rated make before break maintenance bypass operation- Optional break-less load transfer via static switch- Low harmonic distortion- High crest factor tolerance and dynamic stability- Lower TCO- Continuous full rated power at ambient as high as 45°C- N+1 Parallel operation of UPS without any common hardware- Advanced Communication Capability (RS485/Modbus/SNMP)- High branch fuse clearing capacity- On-line battery bank test without load disconnection- Compact, elegant, and light weight enclosure- Easy installation with wheels for maneuverability and front bottom terminals
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783106-01 -
NI
400 Vrms L-N, 800 Vrms L-L, 50 kS/s/ch, 24-Bit, 3-Phase C Series Voltage Input Module - The NI‑9244 performs single-ended analog input. The wide measurement range makes it ideal for high-voltage measurement applications such as phasor measurements, power metering, power quality monitoring, industrial machinery, and motor test. You can also perform transient and harmonic analysis with high-speed simultaneous sampling. The NI‑9244 offers three channels, so you can connect single‑ or three‑phase measurement configurations such as WYE and delta. You can incorporate the NI‑9244 into systems to meet standards such as IEC 61010‑1, C37.90 and C37.60, IEC 60255‑22‑(1:7), IEC 60255‑1, C37.188 Class M and P, EMC section of IEC 60870, EMC sections of IEC 61850, IEC 61000‑4‑30 Class S, and IEC 61000‑4‑7.
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THL500 -
TMTeck Manufacturing Limited
It is the highest brightness display in China showing all functions and parameters, easy read Largest screen Oled screen and operate,also can save lots of energy .the largest screen of Leeb hardness tester in China. Two hardness scale dual-display in the screen. Measuring direction in 360 and add the auto measure direction to make test easy and precision. Add four new hardness scales, HRA, HB for D impact device of alloy tool steel; HV for cast aluminum alloy. Add New user material function, to meet the need of user can test the special material. Test at any angle, even upside down. Wide measuring range. It can measure the hardness of all metallic materials. Direct display of hardness scales HRB, HRC, HV, HB, HS, HL and three types of strength values immediately. Seven impact devices are available for special application. Automatically identify the type of impact devices. Large capacity memory could store 600 groups (Relative to average times321 ) information including single measured value, mean value, testing data, impact direction, impact times, material and hardness scale etc. Upper and lower limit can be preset. It will alarm automatically when the result value exceeding the limit. Battery information indicates the rest capacity of the battery and the charge status. User calibration function. USB port with the PC humanity multi-functions data proceeding software. Original imported high speed thermal printer support the immediate printing function. It can save data permanently. Li rechargeable battery as the power source. Charge circuit integrated inside the instrument. Continuous working period of no less than 200 hours (EL off and no printing). Auto power off to save energy. Excellent after-sale service system for high quality products---3 years guarantee and all life maintenance. Easy to buy and comfortable to use.
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AIM GmbH
AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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THW-L2 -
Thermtest Instruments
Designed with speed and operational simplicity in mind, the Transient Hot Wire (THW-L2) Liquid Thermal Conductivity Meter is an advanced measurement system for direct determination of the thermal conductivity of liquids and pastes in accordance with ASTM D7896-19. In less than 2 seconds, a single measurement of small volumes of liquids and pastes can be accurately and precisely measured for thermal conductivity. Using a non-stationary measurement approach, the THW-L2 uses rapid test times to limit convective effects for samples with a wide range of viscosities. The THW sensor consists of a 60 mm heating wire that is fully inserted into an isothermal sample. A constant current source (q) is used to heat the sensor wire and the temperature rise is recorded by monitoring the change in electrical resistance of the wire. The slope (m) is determined from the plot of temperature rise vs. logarithm of time and is used in the calculation of thermal conductivity (λ). Liquid samples of high thermal conductivity will have a lower slope, while liquid samples with low thermal conductivity will have a higher slope.
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AIM GmbH
AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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GX3702 -
Marvin Test Solutions, Inc.
The GX3702 is a user configurable, FPGA-based, 3U PXI card which offers 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3702 is supplied with an integral expansion board providing access to the FPGA's 160 I/Os and is pin for pin compatible with the NI PXI 7813R and 7811R FPGA cards . Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera's free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded into the FPGA directly or via an on-board EEPROM.
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CRY2301 -
CRYSOUND
CRY2301 Noise sensor is a new type of noise test equipment independently developed by CRY Sound for industrial grade applications. It can realize real-time noise time domain and frequency domain analysis with real-time spectrum analysis software. The product complies with such standards as IEC61672 (Class 1) and GB/T3785 (Class 1). CRY2301 integrates measurement microphone, preamplifier, data acquisition, and data communication in a compact structure. It supports an optional 1'' high-sensitivity microphone for extremely low sound pressure testing. CRY2301 uses a USB interface for data communication and power supply. As a composite USB device consisting of a USB Audio device and a HID device, it is compatible with 32-bit/64-bit Windows 7 and Windows 10 systems. CRY2301 is equipped with real-time spectrum analysis software for easy access to time and frequency domain measurements. The real-time spectrum analysis software supports frequency weighting and time weighting, and can perform acoustic analysis, such as noise statistical analysis, octave analysis, and FFT analysis.
